Semiconductor

Used to remove back grinding tapes attached on the back side after the wafer back grinding process. By using rubber adhesive with PET materials, it has good initial tack and peel strength.

◈ Custom size, die-cutting parts can be provided as required ☏ sales@deantape.com

Mainly used during the process of QFN packaging, this is applied to the EMC resin sealing process by using excellent heat-resistant polyimide films. It shows good initial tack and unrolls well even during the work process at high temperatures as well as excellent workability during the wire-bonding process.

◈ Custom size, die-cutting parts can be provided as required ☏ sales@deantape.com