• KOREAN
    ENGLSH
    JAPANESE
    CHINESE


- Flat Panel Display
- Semiconductor
- Secondary Battery
- Optic lens molding
- EMI SHEILDING
- Lead frame plating
- Electronic Insulation
- Electrical fitting
- (F)PCB
- Touch Panel
- Others
- EMI Wave Shielding Tapes
-(F)PCB Tape/Film
- Protection Tapes
- Masking Tapes
-Carrier Tape/Film
- Home Appliances Tape/Film
- Heat Resistance Tape
- Tapes for Solar Cell
- Electrical Insulation tape
- Battery Tape/Film
- Double Sided Tape/Films

Semiconductor

BACK GRINDING
Excellent for automatic insertion process based on strong fixation of lead wire

Used to remove back grinding tapes attached on the back side after the wafer back grinding process. By using rubber adhesive with PET materials, it has good initial tack and peel strength.

◈ Custom size, die-cutting parts can be provided as required ☏ sales@deantape.com

MASKING Tape for QFN PKG
HTR tape for semiconductor CSP package manufacturing process

Mainly used during the process of QFN packaging, this is applied to the EMC resin sealing process by using excellent heat-resistant polyimide films. It shows good initial tack and unrolls well even during the work process at high temperatures as well as excellent workability during the wire-bonding process.

◈ Custom size, die-cutting parts can be provided as required ☏ sales@deantape.com