Semiconductor

HTR tape for semiconductor CSP package manufacturing process

Mainly used during the process of QFN packaging, this is applied to the EMC resin sealing process by using excellent heat-resistant polyimide films. It shows good initial tack and unrolls well even during the work process at high temperatures as well as excellent workability during the wire-bonding process.

◈ Custom size, die-cutting parts can be provided as required ☏ sales@deantape.com