Industrial Adhesive Tapes | Business & Products | Deantape

Semiconductor

BACK GRINDING
Excellent for automatic insertion process based on strong fixation of lead wire

Used to remove back grinding tapes attached on the back side after the wafer back grinding process. By using rubber adhesive with PET materials, it has good initial tack and peel strength.


◈ Custom size, die-cutting parts can be provided as required ☏ sales@deantape.com

Product
No
Material Adhesive Color Total Thickness
(㎜)
Pulling off force
(㎏/13㎜)
Tensile Strength
(Kg/25mm)
Elongation
(%)
BR350A PET 0.05 0.085 Trans Rubber 2500 18 120