(F)PCB

Tape for Protecting Artwork Films

Thin film for protection

It is made of thin PET films and acrylic adhesive with less reactivity to UV light. With special release treatment on the back side, it prevents solder-resistant ink from being smeared when the substrate and the artwork film are separated.

Carrier Tape

Maintaining thickness and strength for FPCB process

This product is used for carriers in the (F)PCB process and to prevent failures in processes that may be made due to the flexibility of (F)PCB and keep the status of the back surface. By using very strong, high-resistant and highly stabilized adhesive, it is cleanly removed after processes

EAD Substrate Masking Tape

Heat resistant masking tape for manufacturing EAD substrates

This product is used to protect auxiliary molding and substrates for manufacturing EAD substates. By using high heat-resistant polyimide films and silicon PSA, it has good shrink-resistance against deformation that may occur during the process. In addition, the specially manufactured silicon PSA provides workability without any residues and contamination even under high temperature and high pressure conditions.