Masking Tapes
High Insulation masking tape for fixing SUS and chip when Semiconductor BGA module manufacturing (for finishing work)
Custom size, die-cutting parts can be provided as required ☏ sales@deantape.com High Insulation masking tape is a single coated high heat resistance tape used for Semiconductor BGA module manufacturing. It is generally used silicone tape laminated with fluorosilicone release liner that can be supplied as die-cut and suitable for insulation finishing work. The product is also featured with 70um total thickness and 200gf/in peel strength.
|
|
 |
| Feature | Details |
| Brand Name | [DT] Masking tape |
| Use | Masking |
| Material | Polyimide |
| Model Number: | ST-830LAFL |
| Adhesive: | Silicone |
| Adhesive Side: | Single-Sided |
| Adhesive Type: | Pressure Sensitive |
| Color | Amber |
| Price | Negotiable |
| Design Printing: | No Printing |
| MOQ | Negotiable |
| Feature | Heat-Resistant, Fluorosilicone Release Liner |
| Supply Ability | 300000 Square Meter/Square Meters per Day |
| Supply type | Roll / Die-cut |
