Lead frame plating
Transparent Type
Used to set the lead frame plating area for semiconductors This product is used for lead frame plating and adhering non-plated parts to improve electric and thermal features of the lead frames. It maintains stabilized adhesion to the chemical plating liquid with high cohesion in the adhesive and does not leave any stains or residues when it is removed after plating.
|
 |
|
| Product Name | Base Film (mm) | Color | Total Thickness (mm) | Adhesion (gf/25mm) | Tensile Strength (N/cm) | Elongation (%) |
| 9231 | PET(0.023) | Trans | 0.028 | 300 | 35.3 | 100 |
| 9231KH | PET(0.019) | Trans | 0.022 | 400 | 31.4 | 100 |
| 9231K | PET(0.019) | Trans | 0.022 | 230 | 31.4 | 100 |
